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铜箔类型
Foil type
常规厚度/μm
Typical thickness (μm)
压合面粗糙度Rz/μm@1OZ
Bonding side roughness Rz (μm)@1OZ
典型应用和特点
Typical application and peculiarity
指标要求
Performance index
典型值
Typical data
毛面处理
Matte Side Treated
HTE 12/15/18/35/70/105 ≤10 8.5 普通环氧树脂
Conventional epoxy
HTE-HSP 12/18/35 ≤10 8.5 高性能环氧,PPO/PPE
High performance epoxy, PPO/PPE
HTE-TCH 12/18/35 ≤12 10.0  高频板,碳氢树脂
High frequency board, hydrocarbon
HTE-A 12/18 ≤61/3OZ 3.6 封装载板领域
Packages substrates
HTE-HC 18/25/35 ≤12 10.5 PTC电阻,高抗剥
Positive temperature resistance, high peel strength
LP-S-P/B 12/18/25/35/50 ≤7.0 6.0  3层法软板,电磁屏蔽,环保
3L-FCCL, EMI, green
T1B-DSP
(HVLP1)
12/18/35 ≤2.0 1.7 高速讯号传输板,基站/服务器,PPO/PPE
High speed digital, base station/server, PPO/PPE
T1A-DSP
(HVLP2)
12/18/35 ≤1.5 1.3 高速讯号传输板,基站/服务器,PPO/PPE
High speed digital, base station/server, PPO/PPE
T0B-DSP
(HVLP3)
12/18/35 ≤1.0 0.8 高速讯号传输板,基站/服务器,PPO/PPE,碳氢树脂
High speed digital, base station/server, PPO/PPE, hydrocarbon
T0B-L-DSP
(HVLP4)
12/18/35 ≤0.8 0.6 高速讯号传输板,基站/服务器,PPO/PPE,碳氢树脂
High speed digital, base station/server, PPO/PPE, hydrocarbon
T1A-X-DSP
(HVLP2)
12/18/35 ≤1.5 1.3 高频板,PTFE
High frequency board, PTFE
T0B-X-DSP
(HVLP3)
12/18/35 ≤1.0 0.8 高频板,PTFE
High frequency board, PTFE
T0A-DSP
(HVLP3)
12/18/35 <1.0 0.7 高频软板,LCP/MPI/MTPI
High frequency board, LCP/MPI/MTPI
光面处理
Shiny Side Treated
RT3-MP-HSP 12/15/18/35/70 ≤3.5 2.8  中高Tg,无铅,无卤,PPO/PPE
Middle/high Tg, lead-free and halogen-free, PPO/PPE
RT2A-MP
(RTF2
)
12/18/35 ≤2.3 1.9  服务器/转换器/存储器,PPO/PPE
Server/switch/storage, PPO/PPE
RT1B-MP
(RTF3)
12/18/35 ≤2.0 1.7 服务器/转换器/存储器,PPO/PPE
Server/switch/storage, PPO/PPE
RT3-MP 12/18/35 ≤4.0 3.2 高频板,碳氢树脂,PTFE
High frequency board, hydrocarbon, PTFE
RT2-MP 12/18/35 ≤3.0 2.5 高频板,碳氢树脂,PTFE
High frequency board, hydrocarbon, PTFE
LP-D-P/B 12/18/35/50 ≤3.0 2.1 2层法软板,电磁屏蔽,无线充电,环保
2L-FCCL, EMI, wireless charging, green

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